Molex connectors near me4/14/2024 Mirror Mezz Enhanced extends the capabilities of Mirror Mezz and Mirror Mezz Pro, which were selected as the Open Accelerator Module (OAM) standard by the Open Accelerator Infrastructure Group, a subgroup of the Open Compute Project (OCP).Mirror Mezz™ Enhanced-an addition to the Mirror Mezz family of genderless mezzanine board-to-board connectors, this product supports 224 Gbps-PAM4 speeds while addressing varying height requirements and PCB space constraints, as well as manufacturing and assembly challenges, to lower application costs and time to market. To that end, a cross-functional, global team of Molex engineers collaborated closely with customers, technology leaders and suppliers, using the latest predictive analytics and advanced software simulations, to speed the design and development of a full portfolio of best-in-class solutions, including: “Our transparent, co-development approach facilitates early engagement with stakeholders across the 224G ecosystem to identify and resolve potential performance bottlenecks and design challenges, ranging from signal integrity and EMI reduction to the need for more efficient thermal management.”Ĭonnectivity Innovations Empower the 224G EcosystemĮntirely new system architectures with multiple chip-to-chip connection schemes will be required to achieve data rates up to 224 Gbps-PAM4, which represents an important yet complex technology inflection point. “Molex is collaborating closely with major technology innovators, as well as key data center and enterprise customers, to set an aggressive pace for 224G product introductions,” said Jairo Guerrero, VP & GM, Copper Solutions, at Molex. As a result, Molex is uniquely positioned to meet heightened demands for the fastest available data rates powering advanced technology, including generative AI, machine learning (ML), 1.6T networking and other high-speed applications. Furthermore, Molex has a wide range of connectors for almost all connector requirements in nearly all the markets.LISLE, IL – – Molex, a global electronics leader and connectivity innovator, has introduced the industry’s first chip-to-chip 224G product portfolio, encompassing next-gen cables, backplanes, board-to-board connectors and near-ASIC connector-to-cable solutions operating at speeds up to 224 Gbps-PAM4. MicroTPA Wire-to-Board and Wire-to-Wire Connector System is available in 2- to 15-circuit single-row connectors in vertical configurations with TPA retainer. MicroTPA Wire-to-Board and Wire-to-Wire Connector System is a very compact connector system with 2.00mm pitch and positive lock.Ĭustomers choose different connectors from different vendors, this makes their procurement process complex and often causes compatibility issues. Often designers from consumer and vehicle industries have a footprint space issue on their PC board because of increasing demand for more components. MicroTPA vertical high wall header with raised bottom and ledge allows application of potting material to cover the PC board. Water sensitive consumer applications require potting sealing on their PC board. High retention force and inner lock provides electrical reliability in rugged environments. MicroTPA Wire-to-Board and Wire-to-Wire Connector System features terminal design with positive lock for secure mating retention. Rugged automobile and industrial applications can be subject to shock, vibration or rough handling that can dislodge terminals and cause signal interference.
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